BaoHong Technology Co., Ltd. was established in April 2006 and is a wholly-owned subsidiary of ChuanBao Group. Currently, we are one of the leading manufacturers of semiconductor recycling equipment in the cross-strait region. As of 2021, we have sold over 800 process equipment units, serving major domestic wafer fabs as well as global wafer fabs in China, South Korea, Japan, Singapore, and other countries.
BaoHong Technology specializes in providing mature semiconductor process equipment and is also an expert in advanced automation wafer handling modules and material surface treatment. We have a competitive advantage in semiconductor advanced process system integration capabilities and key technologies. With a complete supply chain and a high rate of localized component substitution, we are able to effectively reduce the cost of critical components and ensure on-time delivery to our customers. In recent years, BaoHong has actively invested in the development of advanced process transfer modules, such as EFEM and VTM, as well as research and development of atomic layer deposition and etching equipment (PEALD/ALE).
Honesty, integrity, and trust are our core values. BaoHong Technology is committed to establishing long-term partnerships with our customers based on these values, providing high-quality products and services.
Follows through the commitments and ensures our actions are consistent with customer
specification requirement. Shares information in an open, honest and straightforward manner.
Performs in accordance with ISO 9001:2008 & Applied Materials OEM ISAT Standard.
Following up our internal administrative systems (ERP & EZFLOW) to provide value-added services.
Recognition award from our worldwide valuable customers – TSMC, UMC, SSMC, VIS, MXIC & Applied Materials etc.
Engineer: Avg. > 8 year experienced team from OEM & Semi fabrication (TSMC, UMC etc.)
Management Team : Avg. >10 year OEM, fabrication & various field projects management experience.
CBT patent strategy is a series of step that companies take in order to secure their inventions and their position within the technological sector in which they operate.
Performs in accordance with ISO 9001:2008 & Applied Materials OEM ISAT Standard.
Following up our internal administrative systems (ERP & KMS) to provide value-added services.
Recognition award from our worldwide valuable customers – TSMC, UMC, SSMC, VIS, MXIC & Applied Materials etc.
Apr.
寶虹科技股份有限公司成立。
與OEM原廠簽定為期五年獨家服務合約(Exclusive Service Outsource Contract)
Jul.
成立半導體主要零件再生、維修中心，並先後獲OEM及知名晶圓大廠設備認證。
Apr.
通過英國勞氏ISO 9001品質管理系統認證。
Jul.
成立設備研發與翻修中心，國內一線大廠合作，完成首台CVD(氣相化學沉積)再生設備銷售、安裝並順利投入客戶生產線。
May.
通過應用材料公司 Applied Materials ISAT零組件再生、維修中心認證。
Feb.
成立MKS RPS(遠端電漿生成器)再生、維修中心。
Jun.
導入ERP system(企業資源規劃)
Oct.
導入企業知識管理系統(KM)。
與OEM原廠簽定為期五年獨家服務合約(Exclusive Service Outsource Contract)
Apr.
再生設備累計出貨達200台。
併入翔名科技成為其100%子公司。
Dec.
與客戶共同開發企業之金屬蝕刻設備正式投入其生產行列。
成立A-Team聯盟，設立蘇州大陸組件再生中心。
Aug.
併入川寶科技成為其100%子公司。
與韓國Cymechs簽訂代理合作開發先進晶圓自動化傳送系統。
與APT合作開發完成半導體前端晶圓傳送模組(EFEM)並成功交付INTEL。
集團新竹研發暨軟體加速中心成立，
與抱樸科技合作開發PEALD / ALE量產設備，首台完成交付工研院。